硕士德合物系统EP101是一种双组分低粘度的半刚性性环氧复合粘接密封和。 其特点是在环境温度下工作寿命可时在250-300 ° F的温度围治愈。 治愈后收缩是最小的。 固化后的材料具有优异的着力以属和多其他基板。 物理强度和电绝缘性优于些大多数环境温度和多其他热固化环氧树展出特别是关于冲击振动和冲击。 EP101也有在温度于300 ° F。优的热稳定性 化学抗水盐无机碱和多溶剂是常令人满意的。 矿物填充的EP101版本为特殊应用。

Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300°F range. Shrinkage upon cure is minimal. The cured material has excellent adhesion to metals and many other substrates. Physical strength and electrical insulation properties are superior to those exhibited by most ambient temperature and many other heat curing epoxies particularly as regards resistance to impact, vibration and shock. The EP101 also has excellent thermal stability at temperatures above 300°F. The chemical resistance to water, salts, inorganic acids, alkalis and many solvents is highly satisfactory. Mineral filled versions of EP101 are available for special applications.

硕士德合物系统EP101是一种双组分低粘度的半刚性性环氧复合粘接密封和。 其特点是在环境温度下工作寿命可时在250-300 ° F的温度围治愈。 治愈后收缩是最小的。 固化后的材料具有优异的着力以属和多其他基板。 物理强度和电绝缘性优于些大多数环境温度和多其他热固化环氧树展出特别是关于冲击振动和冲击。 EP101也有在温度于300 ° F。优的热稳定性 化学抗水盐无机碱和多溶剂是常令人满意的。 矿物填充的EP101版本为特殊应用。

Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300°F range. Shrinkage upon cure is minimal. The cured material has excellent adhesion to metals and many other substrates. Physical strength and electrical insulation properties are superior to those exhibited by most ambient temperature and many other heat curing epoxies particularly as regards resistance to impact, vibration and shock. The EP101 also has excellent thermal stability at temperatures above 300°F. The chemical resistance to water, salts, inorganic acids, alkalis and many solvents is highly satisfactory. Mineral filled versions of EP101 are available for special applications.

硕士德合物系统EP101是一种双组分低粘度的半刚性性环氧复合粘接密封和。 其特点是在环境温度下工作寿命可时在250-300 ° F的温度围治愈。 治愈后收缩是最小的。 固化后的材料具有优异的着力以属和多其他基板。 物理强度和电绝缘性优于些大多数环境温度和多其他热固化环氧树展出特别是关于冲击振动和冲击。 EP101也有在温度于300 ° F。优的热稳定性 化学抗水盐无机碱和多溶剂是常令人满意的。 矿物填充的EP101版本为特殊应用。

Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300°F range. Shrinkage upon cure is minimal. The cured material has excellent adhesion to metals and many other substrates. Physical strength and electrical insulation properties are superior to those exhibited by most ambient temperature and many other heat curing epoxies particularly as regards resistance to impact, vibration and shock. The EP101 also has excellent thermal stability at temperatures above 300°F. The chemical resistance to water, salts, inorganic acids, alkalis and many solvents is highly satisfactory. Mineral filled versions of EP101 are available for special applications.