Epoxy resin / underfill flip chip EP3RRLV/EP30AO/EP37-3FLF 环氧树脂/倒装芯片底部填充胶ep3rrlv / ep30ao / ep37-3flf

Characteristics
特点
Type:
类型：
epoxy
环氧树脂
Technical characteristics:
技术特点：
underfill flip chip
倒装芯片底部填充胶
Description
描述
Master Bond’s line of epoxy underfill compositions aim to provide excellent under fill to die passivization, high reliability and excellent adhesion as well as to deliver improved mechanical support, lower the strain on solder joints and offer excellent moisture protection.
环氧填充组合物主键的行致力提供优良的下填充模具结构、高可靠性和优异的附着力，以及改进的机械支持的传递，降低焊点的应变和提供优良的防潮保护。
In addition it offers high purity, low thermal expansion coefficient and out-gassing with a high glass transition temperature, high Young’s module and a short cure cycle. It features high resistances to thermal cycling as well as shock and vibration. Additionally, some of the applications of this product include flip chip devices, ball grid arrays and chip scale packaging.
此外，它提供了高纯度、低的热膨胀系数和出气具有高的玻璃化转变温度，高的杨氏模量和缩短治疗周期。它具有高电阻的热循环，以及冲击和振动。此外，该产品的一些应用包括倒装芯片设备，球栅阵列和芯片规模封装。

Epoxy resin / underfill flip chip EP3RRLV/EP30AO/EP37-3FLF 环氧树脂/倒装芯片底部填充胶ep3rrlv / ep30ao / ep37-3flf

Epoxy resin / underfill flip chip EP3RRLV/EP30AO/EP37-3FLF 环氧树脂/倒装芯片底部填充胶ep3rrlv / ep30ao / ep37-3flf

Characteristics
特点
Type:
类型：
epoxy
环氧树脂
Technical characteristics:
技术特点：
underfill flip chip
倒装芯片底部填充胶
Description
描述
Master Bond’s line of epoxy underfill compositions aim to provide excellent under fill to die passivization, high reliability and excellent adhesion as well as to deliver improved mechanical support, lower the strain on solder joints and offer excellent moisture protection.
环氧填充组合物主键的行致力提供优良的下填充模具结构、高可靠性和优异的附着力，以及改进的机械支持的传递，降低焊点的应变和提供优良的防潮保护。
In addition it offers high purity, low thermal expansion coefficient and out-gassing with a high glass transition temperature, high Young’s module and a short cure cycle. It features high resistances to thermal cycling as well as shock and vibration. Additionally, some of the applications of this product include flip chip devices, ball grid arrays and chip scale packaging.
此外，它提供了高纯度、低的热膨胀系数和出气具有高的玻璃化转变温度，高的杨氏模量和缩短治疗周期。它具有高电阻的热循环，以及冲击和振动。此外，该产品的一些应用包括倒装芯片设备，球栅阵列和芯片规模封装。

Epoxy resin / underfill flip chip EP3RRLV/EP30AO/EP37-3FLF 环氧树脂/倒装芯片底部填充胶ep3rrlv / ep30ao / ep37-3flf

Epoxy resin / underfill flip chip EP3RRLV/EP30AO/EP37-3FLF 环氧树脂/倒装芯片底部填充胶ep3rrlv / ep30ao / ep37-3flf

Characteristics
特点
Type:
类型：
epoxy
环氧树脂
Technical characteristics:
技术特点：
underfill flip chip
倒装芯片底部填充胶
Description
描述
Master Bond’s line of epoxy underfill compositions aim to provide excellent under fill to die passivization, high reliability and excellent adhesion as well as to deliver improved mechanical support, lower the strain on solder joints and offer excellent moisture protection.
环氧填充组合物主键的行致力提供优良的下填充模具结构、高可靠性和优异的附着力，以及改进的机械支持的传递，降低焊点的应变和提供优良的防潮保护。
In addition it offers high purity, low thermal expansion coefficient and out-gassing with a high glass transition temperature, high Young’s module and a short cure cycle. It features high resistances to thermal cycling as well as shock and vibration. Additionally, some of the applications of this product include flip chip devices, ball grid arrays and chip scale packaging.
此外，它提供了高纯度、低的热膨胀系数和出气具有高的玻璃化转变温度，高的杨氏模量和缩短治疗周期。它具有高电阻的热循环，以及冲击和振动。此外，该产品的一些应用包括倒装芯片设备，球栅阵列和芯片规模封装。

Epoxy resin / underfill flip chip EP3RRLV/EP30AO/EP37-3FLF 环氧树脂/倒装芯片底部填充胶ep3rrlv / ep30ao / ep37-3flf