Epoxy adhesive / two-component / low bonding strength EP37-3FLF 双组分环氧胶粘剂/ /粘结强度低ep37-3flf

Characteristics
特点
Chemical composition:
化学成分：
epoxy
环氧树脂
Number of components:
零件编号：
two-component
双组分
Technical characteristics:
技术特点：
low bonding strength
低粘结强度
Description
描述
The MasterBond EP37-3FLF is a dual-component epoxy resin polymer system engineered to deliver comprehensive adhesion, casting, and coating operations. It features a minimal viscosity level, high malleability, a 1-to-1 amalgamation ratio by volume or weight, and a seamless adhesion capability almost any type of substrate, such as ceramics, glass, various plastics, rubber, and certain metals.
的开发设计ep37-3flf是双组分环氧树脂聚合物系统工程提供全面的粘附，铸造，涂料业务。它具有一个最小的粘度水平，高延展性，体积或重量的1对1的融合率，和无缝的粘附能力几乎任何类型的基板，如陶瓷、玻璃、各种塑料、橡胶和某些金属。
MasterBond’s EP37-3FLF Polymer System is not only a high-quality adhesion system; it is also a fine-quality encapsulating, casting, and potting agent. Its minimized exotherm ratings (relatively lower compared with other similar systems) turn it into the ideal system for immense casting management applications. Its added electricity component tolerance further boosts its other functions as well. With high electrical-retardant properties, lowered exotherm levels, and adaptability in its operational functions, the MasterBond EP37-3FLF is ideal for electrical, optical, electronic, computer, opto-electronic, and specialty OEM-style fields of application.
开发设计的ep37-3flf聚合物系统不仅是一个高品质的粘合体系；它也是一个优质的封装、铸造和灌封剂。其最小放热率（相对较低，与其他同类系统相比）把它变成理想的系统巨大的铸造管理应用。它增加了电力元件的耐受性，进一步提高了它的其他功能。高电气阻燃性能，降低温升的水平，和适应性的运行功能，是理想的开发设计ep37-3flf电学、光学、电子、计算机、光电、专业OEM方式的应用领域。

Epoxy adhesive / two-component / low bonding strength EP37-3FLF 双组分环氧胶粘剂/ /粘结强度低ep37-3flf

Epoxy adhesive / two-component / low bonding strength EP37-3FLF 双组分环氧胶粘剂/ /粘结强度低ep37-3flf

Characteristics
特点
Chemical composition:
化学成分：
epoxy
环氧树脂
Number of components:
零件编号：
two-component
双组分
Technical characteristics:
技术特点：
low bonding strength
低粘结强度
Description
描述
The MasterBond EP37-3FLF is a dual-component epoxy resin polymer system engineered to deliver comprehensive adhesion, casting, and coating operations. It features a minimal viscosity level, high malleability, a 1-to-1 amalgamation ratio by volume or weight, and a seamless adhesion capability almost any type of substrate, such as ceramics, glass, various plastics, rubber, and certain metals.
的开发设计ep37-3flf是双组分环氧树脂聚合物系统工程提供全面的粘附，铸造，涂料业务。它具有一个最小的粘度水平，高延展性，体积或重量的1对1的融合率，和无缝的粘附能力几乎任何类型的基板，如陶瓷、玻璃、各种塑料、橡胶和某些金属。
MasterBond’s EP37-3FLF Polymer System is not only a high-quality adhesion system; it is also a fine-quality encapsulating, casting, and potting agent. Its minimized exotherm ratings (relatively lower compared with other similar systems) turn it into the ideal system for immense casting management applications. Its added electricity component tolerance further boosts its other functions as well. With high electrical-retardant properties, lowered exotherm levels, and adaptability in its operational functions, the MasterBond EP37-3FLF is ideal for electrical, optical, electronic, computer, opto-electronic, and specialty OEM-style fields of application.
开发设计的ep37-3flf聚合物系统不仅是一个高品质的粘合体系；它也是一个优质的封装、铸造和灌封剂。其最小放热率（相对较低，与其他同类系统相比）把它变成理想的系统巨大的铸造管理应用。它增加了电力元件的耐受性，进一步提高了它的其他功能。高电气阻燃性能，降低温升的水平，和适应性的运行功能，是理想的开发设计ep37-3flf电学、光学、电子、计算机、光电、专业OEM方式的应用领域。

Epoxy adhesive / two-component / low bonding strength EP37-3FLF 双组分环氧胶粘剂/ /粘结强度低ep37-3flf

Epoxy adhesive / two-component / low bonding strength EP37-3FLF 双组分环氧胶粘剂/ /粘结强度低ep37-3flf

Characteristics
特点
Chemical composition:
化学成分：
epoxy
环氧树脂
Number of components:
零件编号：
two-component
双组分
Technical characteristics:
技术特点：
low bonding strength
低粘结强度
Description
描述
The MasterBond EP37-3FLF is a dual-component epoxy resin polymer system engineered to deliver comprehensive adhesion, casting, and coating operations. It features a minimal viscosity level, high malleability, a 1-to-1 amalgamation ratio by volume or weight, and a seamless adhesion capability almost any type of substrate, such as ceramics, glass, various plastics, rubber, and certain metals.
的开发设计ep37-3flf是双组分环氧树脂聚合物系统工程提供全面的粘附，铸造，涂料业务。它具有一个最小的粘度水平，高延展性，体积或重量的1对1的融合率，和无缝的粘附能力几乎任何类型的基板，如陶瓷、玻璃、各种塑料、橡胶和某些金属。
MasterBond’s EP37-3FLF Polymer System is not only a high-quality adhesion system; it is also a fine-quality encapsulating, casting, and potting agent. Its minimized exotherm ratings (relatively lower compared with other similar systems) turn it into the ideal system for immense casting management applications. Its added electricity component tolerance further boosts its other functions as well. With high electrical-retardant properties, lowered exotherm levels, and adaptability in its operational functions, the MasterBond EP37-3FLF is ideal for electrical, optical, electronic, computer, opto-electronic, and specialty OEM-style fields of application.
开发设计的ep37-3flf聚合物系统不仅是一个高品质的粘合体系；它也是一个优质的封装、铸造和灌封剂。其最小放热率（相对较低，与其他同类系统相比）把它变成理想的系统巨大的铸造管理应用。它增加了电力元件的耐受性，进一步提高了它的其他功能。高电气阻燃性能，降低温升的水平，和适应性的运行功能，是理想的开发设计ep37-3flf电学、光学、电子、计算机、光电、专业OEM方式的应用领域。

Epoxy adhesive / two-component / low bonding strength EP37-3FLF 双组分环氧胶粘剂/ /粘结强度低ep37-3flf