Master Bond Polymer System Supreme 10HTN represents a breakthrough in conductive epoxy adhesive technology featuring a combination of high performance properties including both high shear and high peel strengths, relatively low resistance, and exceptionally easy processing. This one component (no mix) high purity nickel conductive system is formulated to cure at elevated temperatures, e.g. 45 minutes at 275°F-300°F, 1 hour at 250°F. Minimum curing temperature is 250°F. Tensile shear strengths in excess of 1200 psi and T-peel strengths in excess of 5 pli are readily obtained. Supreme 10HTN produces its high performance bonds for service over the wide temperature range of below 4K to 400°F. It offers very superior resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Supreme 10HTN can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents, although it can be made thinner by adding 5 to 10% of xylene or acetone by weight.

Supreme 10HTN forms tough, electrically conductive bonds that are resistant to many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. The electrical conductivity is fully retained even upon severe thermal cycling. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is superb. The cured system is also superior thermal conductor. Supreme 10HTN offers the convenience of a heat cure with no mixing prior to use. It cures to form high performance bonds that are well suited for the most difficult applications in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries.

Master Bond Polymer System Supreme 10HTN represents a breakthrough in conductive epoxy adhesive technology featuring a combination of high performance properties including both high shear and high peel strengths, relatively low resistance, and exceptionally easy processing. This one component (no mix) high purity nickel conductive system is formulated to cure at elevated temperatures, e.g. 45 minutes at 275°F-300°F, 1 hour at 250°F. Minimum curing temperature is 250°F. Tensile shear strengths in excess of 1200 psi and T-peel strengths in excess of 5 pli are readily obtained. Supreme 10HTN produces its high performance bonds for service over the wide temperature range of below 4K to 400°F. It offers very superior resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Supreme 10HTN can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents, although it can be made thinner by adding 5 to 10% of xylene or acetone by weight.

Supreme 10HTN forms tough, electrically conductive bonds that are resistant to many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. The electrical conductivity is fully retained even upon severe thermal cycling. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is superb. The cured system is also superior thermal conductor. Supreme 10HTN offers the convenience of a heat cure with no mixing prior to use. It cures to form high performance bonds that are well suited for the most difficult applications in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries.