Supreme 10ANHT

One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity

Supreme 10ANHT One Part Epoxy

Master Bond Polymer Adhesive Supreme 10ANHT represents a breakthrough in epoxy adhesive technology featuring a thus far unattainable balance of performance properties including high shear and high peel strength plus exceptionally high thermal conductivity. This one component adhesive system is formulated to cure at elevated temperatures, e.g. 1 hour at 300°F, longer times at lower temperatures for maximum bond strengths (minimum curing temperature 250°F at the bond line). No mixing is necessary prior to use. Master Bond Polymer Adhesive Supreme 10ANHT produces truly exceptionally strong bonds with both high shear and high peel strength for service in the remarkably wide temperature range of below 4K to over 400°F. It offers very superior resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Master Bond Polymer Adhesive Supreme 10ANHT can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents.

Master Bond Polymer Adhesive Supreme 10ANHT produces durable high strength, exceptionally tough bonds which are remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Unlike many other epoxy adhesives, its performance is relatively insensitive to changes in cure schedules or substrate cleaning procedures. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. Color is gray. Master Bond Polymer Adhesive Supreme 10ANHT offers the convenience of a heat cure with no mixing prior to use and a uniquely favorable bonding performance for even the most difficult application in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries. It has performed exceptionally well in cryogenic applications.

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Supreme 10ANHT

One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity

Supreme 10ANHT One Part Epoxy

Master Bond Polymer Adhesive Supreme 10ANHT represents a breakthrough in epoxy adhesive technology featuring a thus far unattainable balance of performance properties including high shear and high peel strength plus exceptionally high thermal conductivity. This one component adhesive system is formulated to cure at elevated temperatures, e.g. 1 hour at 300°F, longer times at lower temperatures for maximum bond strengths (minimum curing temperature 250°F at the bond line). No mixing is necessary prior to use. Master Bond Polymer Adhesive Supreme 10ANHT produces truly exceptionally strong bonds with both high shear and high peel strength for service in the remarkably wide temperature range of below 4K to over 400°F. It offers very superior resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Master Bond Polymer Adhesive Supreme 10ANHT can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents.

Master Bond Polymer Adhesive Supreme 10ANHT produces durable high strength, exceptionally tough bonds which are remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Unlike many other epoxy adhesives, its performance is relatively insensitive to changes in cure schedules or substrate cleaning procedures. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. Color is gray. Master Bond Polymer Adhesive Supreme 10ANHT offers the convenience of a heat cure with no mixing prior to use and a uniquely favorable bonding performance for even the most difficult application in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries. It has performed exceptionally well in cryogenic applications.

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