One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
Master Bond EP3RR-1 is a one component, lower viscosity epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 230-250°F. This unique formulation has high mechanical strength properties, outstanding dimensional stability, superior thermal conductivity and is eminently processable. It doesn’t require any mixing, it offers exquisite flow properties and has an unlimited working life. EP3RR-1 also has sterling electrical insulation properties. One particularly uncommon and highly desirable property is its ability to cure in thicker sections up to 1 inch deep.
EP3RR-1 features versatile curing schedules with a 20-30 minute cure at temperatures as low as 230-250°F and a 10-15 minute cure at 300°F. EP3RR-1 has a broad service temperature range of -60°F to +350°F. It adheres well to metals, composites, ceramics, glass and most plastics. It has good resistance to a wide variety of water, oils and fuels. The color of EP3RR-1 is light yellow; other colors are available upon request. EP3RR-1 is a highly effective underfill epoxy and is widely used for microelectronics assembly and packaging applications, especially where good mechanical properties, convenient handling and fast curing are required. EP3RR-1 is available in syringes for manual or automatic dispensing.
Product Advantages
- Single component; no mixing needed; unlimited working life at room temperature.
- Rapid curing with versatile cure schedules.
- Top flight dimensionally stable.
- Highly effective thermal conductivity and electrical isolation properties.
- Convenient handling; excellent flow properties.
- Exemplary performance as an underfill epoxy.
- Can be cast in thicknesses up to 1 inch.